辽宁快乐12开奖结果 www.pjb7.com Dr. Leechung Yiu joined us in October 2008 as Senior Vice President of Engineering. Dr. Yiu has over 30 years of product development experience in the integrated circuit design industry in a broad range of areas including storage, communication and multimedia applications. Before joining us, Dr. Yiu served as Vice President of Engineering at Trident Microsystems, Inc., a digital TV chipset manufacturer, from 2007 to 2008. Dr. Yiu also served as VP of Engineering at Shanghai Huahong International, an integrated device manufacturer, from 2005 to 2007, Sunext Technology Company Limited, a supplier of semiconductor products for Optical Disc Drive applications, from 2003 to 2005 and Marvell Semiconductor, Inc., a fabless semiconductor company, from 1999 to 2003. In 1997, Dr. Yiu co-founded Newave Semiconductor Corp., an integrated circuit design company in China, and served as its Vice President of Engineering from 1997 to 1999. Dr. Yiu received both Ph.D. and master’s degrees in Electrical Engineering from University of California at Berkeley, and a bachelor’s degree in Electrical Engineering from National Taiwan University.
Dr. Jack Gu joined us in February 2006 as Vice President of Sales. Dr. Gu has over 34 years of experience in sales, manufacturing and engineering management in the electronics industry. Prior to joining us, he was a member of the board of directors and Vice President at CEC-View Company Limited in Beijing, a video display company, from 2005 to 2006. Prior to CEC-View, he was the Vice President of Marketing & Sales at Shanghai Belling Co., Ltd, an integrated circuit IDM company, from 1998 to 2005. Dr. Gu holds both master's and Ph.D. degrees in Management Science and Engineering from Shanghai Jiaotong University.
Mr. Gang Shan joined us in August 2005 as Director of Engineering, served as Director of Application/Marketing from 2010 to 2015, and Vice President of Marketing (Data Center Products) since 2015. Mr. Shan has over 19 years of experience in product planning, development, testing, engineering management and technical marketing in the high-speed and high-performance semiconductor industry. Prior to joining us, he worked as Design Manager at Integrated Device Technology Inc. from 2001 to 2005. He also worked as a Senior Design Engineer at Newave Semiconductor Corp., from 1999 to 2001. Mr. Shan holds both master’s and bachelor’s degrees in Electronics and Communications Engineering from Beihang University, Beijing, China.
Mr. Lance Lee joined us in June 2018 as Vice President of Marketing for System Solutions. He has over 30 years of industry experience in IC and system design, product marketing, and executive level management. Before joining us, Mr. Lee served as Product Marketing Director for Lenovo’s new HyperScale organization to build a server product portfolio and create business opportunities for data center customers from January 2015 to June 2018. Prior to Lenovo, he served as Sr. Director of R&D for data center server products and IDM BU General Manager responsible for product design, marketing and business development at Foxconn from 2008 to 2015. Before that, he worked at Anagran Networks as founding Engineering Director from 2004 to 2008. He co-founded Almaden Technology and worked as Vice President of Engineering from 2002 to 2004. From 1985 to 2002, he held various positions in Silicon Valley at Ciena Networks, AMD, Lucent Microelectronics and Pericom Semiconductor Corp. Mr. Lee received a master’s degree in Electrical Engineering from Santa Clara University, and a bachelor’s degree in Electrical Engineering from University of California, Berkeley.
Mr. Geof Findley joined us in March 2018 as VP of Business Development and served as VP of Sales & Business Development since January 2019. Mr. Findley has over 30 years of electronics industry experience in software programming, quality engineering, product management, and business development. Before joining us, Mr. Findley ensured that the Memory industry was aligned with Intel’s client and enterprise products as Director of Intel’s World Wide Memory Enabling and Application Engineering Team, from 1999 to 2018. As Intel’s memory company spokesman, Mr. Findley presented at over 30 worldwide Intel Developer Forums. Prior to Intel, Mr. Findley worked as senior product manager at ROLM/IBM/Siemens, a telecom manufacturer from 1987 to 1998 and as national sales manager at two telecommunication startups from 1998 to 1999. Mr. Findley holds a Master of Business Administration with an emphasis in International Business from Santa Clara/St Edwards and a bachelor’s degree in Systems Engineering with a minor in Computer Science from University of Arizona.
Dr. Zhongyuan Chang joined us in June 2013 as a Vice President of Engineering (Data Center Products). Dr. Chang has over 28 years of experience in analog and mixed-signal product development and engineering management. Prior to joining us, he served as CTO at Shanghai Belling Co. Ltd., from 2010 to 2013. Prior to working at Belling, Dr. Chang served as Vice President at Integrated Device Technology Inc. and General Manager of IDT-Shanghai. Before returning to China, he was a Senior Engineer at Alcatel Inc. in Belgium. Dr. Chang served as an Information Technology Policy Committee member of the Data Converter Subcommittee of IEEE International Solid-State Circuits Conference (ISSCC), from 2004 to 2009. He was an invited speaker at ISSCC in 2004. In addition, Dr. Chang has published over 20 technical articles in IEEE Journals and international conferences, including three papers at ISSCC. He is the first author of the monograph “Low Noise Wideband Amplifiers in Bipolar and CMOS Technology” (Kluwer Academic, 1990). Dr. Chang holds both master’s and Ph.D. degrees in Microelectronic Engineering from Catholic University of Louvain in Belgium.
Mr. Seung Jin (SJ) Seo joined us in February 2012 as a Vice President of Engineering (Validation and Applications). Mr. Seo has more than 27 years of experience in memory module development. Prior to joining us, Mr. Seo served as a Principal Engineer at Samsung Electronics Co., Ltd., a multinational electronics company, from 1989 to 2011, managing a memory module development team with responsibility for all aspects of memory module development. Mr. Seo has extensive experience with key server OEMs, and during his career has been involved in the development of JEDEC standards, module PCB design, verification and system validation testing. Mr. Seo received his bachelor degree in Electronic Engineering from Inha University, Incheon, Korea.
Mr. Gang Shi joined us in August 2017 as VP of Operations (Data Center Products). Mr. Shi has over 26 years of microelectronics industry experience in quality management, operations, R&D, and marketing. Before joining us, he served as General Manager of Protection Products Business Unit (PP BU) of Discrete Products Group (DBG) and concurrently as China Marketing Director of DBG at Diodes Incorporated from 2013 to 2017. He successively held the positions of VP of Back-end Operations and General Manager of Business Unit No. 1 at BCD Semiconductor Manufacturing Limited from 2004 to 2013. He served as Deputy General Manager at Newave Semiconductor Corp. and IDT-Newave Technology from 1998 to 2004. Mr. Shi holds a master’s degree in Microelectronics Engineering and a bachelor’s degree in Semiconductor Physics from Fudan University.
Mr. Kenneth Chew joined us in March 2005 as a Vice President of Operations. From July 2017, Mr. Chew served as VP of Quality. Mr. Chew has over 25 years of experience in semiconductor manufacturing and engineering project management. Prior to joining us, he was the Director of Operations and founding team member at Marvell Asia Pte Ltd, a semiconductor company and subsidiary of Marvell Technology Group Ltd., in Singapore, from 1997 to 2005. Prior to Marvell, he held various engineering manufacturing and project management positions at Adaptec Singapore, a semiconductor company, from 1996 to 1997, and at Silicon Systems Singapore, a semiconductor company, from 1990 to 1996. Mr. Chew holds a master’s degree in Electrical Engineering from Nanyang Technological University of Singapore and a bachelor’s degree in Electronics and Computer Engineering from University of Iowa, USA.